منابع مشابه
Filling through Holes and Blind Micro Vias with Copper Using Reverse Pulse Plating and Insoluble Anodes
This paper presents systematic investigations on complete through hole filling for cores using a Cu electroplating process as an alternative to the common paste plugging process [1]. This technology is targeting at both HDI production and also at the packaging level [2]. This electro plating process consists of two steps, a first process to merge both centers of the through hole walls (X-platin...
متن کاملcharacterization of copper anode slimes from bicc
anode slimes are a by-product of the electrolytic copper refining process, which contain the precious and other important metals .in order to find a suitable method for treating these materials it is necessary to know their phase composition. for the separation of various phases from the complexmixture of copper anode. slime, the slime is leached in various steps and the residues of each step a...
متن کاملAnode Slime Gained During Electrolysis Process of Secondary Copper Anodes
The aim of this research is to get a better understanding of the electrolytic refining process in order to yield the anode slime. Three types of secondary copper anodes are electro refined in an electrolytic system, where the electrolyte is an acid of copper sulphate solution. As a result of the electro-refining process the anode slime has been gained as secondary product. The experimental ...
متن کاملThe chemistry of additives in damascene copper plating
Copper plating baths used for forming integrated circuit interconnects typically contain three or four component additive mixtures which facilitate the superfilling of via holes and trench lines during damascene plating. Extensive study over the last two decades has provided researchers with an understanding of the underlying mechanisms. The role of cuprous intermediates in the copper depositio...
متن کاملDirect Recycling of Copper from Etching to Plating
In the manufacture of printed circuit boards, the copper dissolved during etching can be used to replace the copper needed for plating using a liquid ion-exchange agent. Extraction and stripping studies demonstrated the feasibility. The quality of the etchant was not affected by the presence of the ion-exchange agent. Good-quality deposits were plated from the stripping solution with a current ...
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ژورنال
عنوان ژورنال: Circuit Technology
سال: 1991
ISSN: 1884-118X,0914-8299
DOI: 10.5104/jiep1986.6.5_270